creat by art - ideal for printed circuit board - high case dielectric strength of 1500 vrms - high surge current capability - typical ir less than 0.1 a - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition case: gbu molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 polarity: as marked weight: 4 g (approximately) v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a i 2 ta 2 s cj pf t j o c t stg o c document number: ds_d1409017 version: i14 typical thermal resistance r jc r ja 2 21 note 2: measured at 1mhz and applied reverse bias of 4.0v dc o c/w operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle maximum reverse current @ rated vr t j =25 t j =125 i r 5 a 500 typical junction capacitance per leg (note 2) 211 94 rating of fusing ( t<8.3ms) 166 maximum instantaneous forward voltage (note 1) i f = 4 a i f = 8 a v f 1.0 1.1 v maximum average forward rectified current 8 peak forward surge current, 8.3 ms single half sine-wave i fsm 200 a gbu 806 gbu 807 unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage gbu mechanical data maximum ratings and electrical characteristics (t a =25 o c unless otherwise noted) parameter symbol gbu 801 gbu 802 gbu 803 gbu 804 gbu 805 gbu801 thru gbu807 taiwan semiconductor glass passivated sin g le-phase brid g e rectifier features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
part no. part no. gbu806 gbu806 (t a =25 o c unless otherwise noted) document number: ds_d1409017 version: i14 20 / tube x0 forming ggbu gbu801 thru gbu807 taiwan semiconductor packing code packing code suffix package ordering information ratings and characteristics curves preferred p/n packing code packing code suffix gbu806 c2 c2 green compound description example packing gbu806 c2g c2 g gbu80x (note 1) note 1: "x" defines voltage from 50v (gbu801) to 1000v (gbu807) c2 20 / tube d2 0 2 4 6 8 0 20 40 60 80 100 120 140 160 average forward a current (a) case temperature ( o c) fig.1- maximum derating curve for output current resister or inductive load with heatsink 0 20 40 60 80 100 120 140 160 180 200 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2- maximum forward surge current per leg 8.3ms single half sine wave 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 3- typical reverse characteristics per leg t j =25 o c t j =125 o c 0.1 1 10 100 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 instantaneous forward current (a) instantaneous forward voltage (v) fig. 4- typical forward characteristics per leg
min max min max a 21.80 22.30 0.858 0.878 b 3.50 4.10 0.138 0.161 c 7.40 7.90 0.291 0.311 d 1.65 2.16 0.065 0.085 e 2.16 2.54 0.085 0.100 f 1.65 2.03 0.065 0.080 g 1.52 2.03 0.060 0.080 h 1.02 1.27 0.040 0.050 i 4.83 5.33 0.190 0.210 j 3.30 3.56 0.130 0.140 k 18.30 18.80 0.720 0.740 l 17.50 18.00 0.689 0.709 m 1.90 2.16 0.075 0.085 n 0.46 0.56 0.018 0.022 p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1409017 version: i14 marking diagram gbu gbu801 thru gbu807 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 10 100 1000 0.1 1 10 100 junction capacitance (pf) a reverse voltage (v) fig. 5- typical junction capacitance per leg gbu801- gbu804 gbu805- gbu807 f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1409017 version: i14 gbu801 thru gbu807 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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